SilCool TIA241GF – Liquid Silicone Thermal Pad
TIA241GF is a two-component, flame retardant, thermally conductive silicone gap filler. It is a smooth, non-sagging paste that easily conforms to the complex shapes of any interface design. The cured product creates a thermal path that efficiently dissipates heat from electronic devices. It retains its softness after cure which maximizes stress relief during thermal cycling.
This thermal gap filler can be used as a liquid alternative for prefabricated solid thermal pads.
If lower viscosity is required, use TIA225GF
Features & Benefits
- Thermal conductivity of 4.1 W/m•K
- Quick low-temperature cure
- 1:1 mix ratio
- Flame retardant—meets UL 94V-0
|Catalog Number||Net Weight||Format|
|SilCool TIA241GF||50 kg (110 lbs)||Pail|
|SilCool TIA241GF||3.63 kg (7.93 lbs)||Dual cartridge|