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Thermal Interface Materials

With electronic circuits becoming smaller and more powerful, thermal management has become a critical design parameter to prevent overheating and ultimately circuit failure. Thermal Interface Materials work by displacing air gaps between components and heat sinks to help conduit heat out of the circuit.

MG Chemicals carries three distinct chemistries of TIMs depending on your requirements. For permanent bonds, our line of thermally conductive adhesives is available in a variety of consistencies and working times. For materials that allow for rework, we have both silicone gap fillers which boast very high thermal conductivities and thermal greases which allows for future repairs.

When choosing a TIM, consider all requirements like thermal conductivity, working time, adhesion, and processing to find the right material. Please browse our full product offering and contact Technical Support for any additional help.

Thermally Conductive Adhesives – Thermally conductive, electrically insulating epoxy systems that prevent PCBs from overheating while providing a durable and structural bonding.  

Thermal Pastes – Alternative to adhesives, thermal pads and gap fillers, thermal paste creates a non-permanent bond between heat-generating components and heat sinks. Use these greases to prevent overheating of laptops and gaming consoles.

Thermal Gap Fillers – For superior heat dissipation, consider thermal gap fillers over other solutions. These materials cure to a putty-like consistency that perfectly conform to gaps at the interface between heat-generating components and heat sinks.

Form-In-Place Thermal Gels – Thermally conductive gels for managing energy-intensive devices. With thermal conductivity between 3.5 and 6.0 W/(m·K), these gels are ideal for applications like bonding heat sinks, power semiconductor devices, and LED lighting.