MG Chemicals is the authorized master distributor for Momentive Performance Materials silicone thermal gap fillers. These thermal gap fillers are efficient in maximizing heat dissipation by displacing air between heat-generating components and heat sinks.
They cure to a soft putty which provide excellent thermal conductivity yet can easily be peeled off allowing for components to be replaced. These materials conform to complex geometries and are excellent alternatives to thermal pads.
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TIA225GF is a two-component, flame retardant, thermally conductive silicone gap filler. It is a smooth, non-sagging paste that easily conforms to the complex shapes of any interface design. The cured product creates a thermal path that efficiently dissipates heat from electronic devices. It retains its softness after cure which maximizes stress relief during thermal cycling.
TIA225GF is a two-component, flame retardant, thermally conductive silicone gap filler. It is a smooth, non-sagging paste that easily conforms to the complex shapes of any interface design. The cured product creates a thermal path that efficiently dissipates heat from electronic devices. It retains its softness after cure which maximizes stress relief during thermal cycling.
