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Thermal Gap Fillers

MG Chemicals is the authorized master distributor for Momentive Performance Materials silicone thermal gap fillers. These thermal gap fillers are efficient in maximizing heat dissipation by displacing air between heat-generating components and heat sinks.

They cure to a soft putty which provide excellent thermal conductivity yet can easily be peeled off allowing for components to be replaced. These materials conform to complex geometries and are excellent alternatives to thermal pads.

Features and Benefits

  • Extremely high thermal conductivities
  • UL94 V-0 approved
  • Reworkable
  • Low temperature curing
  • Convenient 1:1 mix ratio


  • Replaces thermal pads
  • Improved thermal performance over pastes
  • Alternative to adhesives if rework is needed

TIA225GF – Thermal conductivity of 2.5 W/m.K

SilCool TIA241GF – Thermal conductivity of 4.1 W/m.K

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