TIA225GF - Silicone Thermal Gap Filler
TIA225GF is a two-component, flame retardant, thermally conductive silicone gap filler. It is a smooth, non-sagging paste that easily conforms to the complex shapes of any interface design. The cured product creates a thermal path that efficiently dissipates heat from electronic devices. It retains its softness after cure which maximizes stress relief during thermal cycling.
This thermal gap filler can be used as a liquid alternative for prefabricated solid thermal pads.
If higher thermal conductivity is desired, use SilCool TIA241GF.
Features & Benefits
- Thermal conductivity of 2.5 W/m•K
- Quick low-temperature cure
- 1:1 mix ratio
- Flame retardant—meets UL 94V-0
|Catalog Number||Net Weight||Format|
|TIA225GFA||50 kg (110 lbs)||Pail|