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Liquid Thermal Gels
MG Chemicals offers 1-part, silicone-free, thermally conductive gels for exceptional thermal management of energy intensive devices. These products have very high thermal conductivity, flame retardancy and an ideal viscosity for form-in-place application.
The low modulus of these gels makes them an ideal material for placing near delicate components or aggressive thermal cycling applications. These gels do not cure so devices can be powered up for use immediately following application.
Features & Benefits
- Very high thermal conductivity between 3.5 and 6.0 W/(m·K)
- Flame retardant—meets UL94 V-0
- Low bond line thickness
- Low modulus—ideal for delicate components
- Wide operating temperature range
- 1-part gel
- Silicone-free
- Tack adhesion—does not run
- Reworkable
Applications
- Bonding heat sinks
- Power semiconductor devices
- Flip chip BGA heat spreaders
- Battery modules and battery packs
- LED lighting
- Power Supplies
- Telecommunication towers
- Data servers
- PCs for gamers
8327GL3 – Thermal conductivity of 3.5 W/(m·K), meets UL94 V-0, silicone-free. Ideal viscosity for dispensing but gel does not run. It does not cure so devices can be powered up immediately following application.
8327GL5 – Thermal conductivity of 5.1 W/(m·K), meets UL94 V-0, silicone free. Ideal viscosity for dispensing but gel does not run. It does not cure so devices can be powered up immediately following application.
8327GL6 – Thermal conductivity of 6.0 W/(m·K), meets UL94 V-0, silicone free. Ideal viscosity for dispensing but gel does not run. Low modulus allows user to achieve bond line thickness less than 25 µm.