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Thermal Gels

MG Chemicals offers a series of 1-part, silicone-free, non-cure, dispensable thermal gels for exceptional thermal management of energy intensive devices. These highly conformable gap filling thermal gels have very high thermal conductivity, flame retardancy and an ideal viscosity for form-in-place applications.

These materials are extremely soft and do not exert much force during expansion and contraction, making them ideal materials to place near delicate components or for applications with aggressive thermal cycling conditions. These gels do not cure so devices can be powered up for use immediately following dispense.

These thermal gels conform and adhere to most surfaces, shapes, and sizes of components with very low compression force. Non-silicone formulas avoid silicone contaminations making these products ideal for optical applications and silicone-free facilities.

They can be easily dispensed from cartridges or pail using pneumatic and automatic dispensers.

For lower viscosity Thermal Interface Materials (TIMs), check out our thermal pastes. Our thermal adhesives are another type of TIMs that provide permanent thermal bonds between heat-generating components and heat spreaders.

Features & Benefits

  • Very high thermal conductivity between 3.5 and 6.0 W/(m·K)
  • Easily dispensable
  • No curing required
  • No pump out – ideal for vertical and vibrating applications
  • Flame retardant—meets UL94 V-0
  • Low bond line thickness – low thermal resistance
  • Low modulus—ultra low compression force
  • Silicone-free
  • Tack adhesion—does not run
  • Reworkable

Applications

  • Bonding heat sinks
  • Power and semiconductor devices
  • Flip chip BGA heat spreaders
  • Battery modules and battery packs
  • LED lighting
  • Power supplies
  • Telecommunication towers and base stations
  • Data servers
  • PCs for gamers
  • Automotive electronic control units (ECUs)

8327GL3 – Thermal conductivity of 3.5 W/(m·K), meets UL94 V-0, silicone-free. Ideal viscosity for dispensing but gel does not run. It does not cure so devices can be powered up immediately following application.

8327GL5 – Thermal conductivity of 5.1 W/(m·K), meets UL94 V-0, silicone free. Ideal viscosity for dispensing but gel does not run. It does not cure so devices can be powered up immediately following application.

8327GL6 – Thermal conductivity of 6.0 W/(m·K), meets UL94 V-0, silicone free. Ideal viscosity for dispensing but gel does not run. Low modulus allows user to achieve bond line thickness less than 25 µm.