4901 – Sn99 No-Clean Solder Wire

4901 Sn99 No-Clean Solder Wire is a solder wire for electronics. It uses a high-purity eutectic Sn99.3/Cu0.7 alloy, complemented by a no-clean, synthetically refined, spatter-proof resin flux core. 4901 solder meets J-STD-004B, ASTM B 32, and exceeds J-STD-006C specifications.

  • Eutectic alloy (liquidus = solidus temperature)
  • Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
  • Flux meets J-STD-004B
  • Resin spreads like rosin-activated flux
  • Virtually non-spattering
  • Non-corrosive
  • Non-conductive
  • Halide-free
  • Suitable for Use in Food Facilities as a Non-Food Chemical—Canadian and NFS recognition letters available on request

4901 lead-free solder achieves a consistent solder and flux percentage thanks to our state-of-the-art extrusion wire-drawing machine, which continuously monitors the wire to prevent voids and ensure consistency, providing a top-grade solder wire.

For a no-clean SAC305 solder wire try 4900. For a water soluble Sn100e solder wire try 49500WS.

We also offer Sn60/Pb40 leaded solder wire (no-clean and RA flux core) and Sn63/Pb37 leaded solder wire (no-clean and RA-like flux core).

Catalog Number Size Diameter Gauge Flux Core % Description
4901-112G 113 g (0.25lb) 0.81 mm (0.032 in) 21 2.2 Pack of 25
4901-227G 227 g (0.5 lb) 0.81 mm (0.032 in) 21 2.2 Pack of 3
4901-454G 454 g (1.0 lb) 0.81 mm (0.032 in) 21 2.2 Spool
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