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4860-4865 - Sn63/Pb37 No-Clean Solder Wire
4860–4865 Sn63/Pb37 No-Clean Solder Wires is electronics grade solder wire. This no-clean solder wire uses the standard eutectic tin-to-lead alloy ratio, which is complemented by a no-clean, synthetically refined, splatter-proof, resin flux core. It meets J-STD-004B, ASTM B 32, and exceeds J-STD-006C specifications. 63/37 solder wire is one of the easiest solders to work with because it combines a low-melting temperature with a sharp melting/solidification point, which results in robust and reliable joints that are highly resistant to whisker formation.
This leaded solder achieves a consistent solder and flux percentage thanks to our state-of-the-art extrusion wire-drawing machine, which continuously monitors the wire to prevent voids and ensure consistency, resulting in a top-grade solder wire.
For Sn63/Pb37 RA solder wire try 4880-4888. We also offer Sn60/Pb40 No-Clean Solder Wire and Sn60/Pb40 RA Solder Wire.
For a lead-free solder wire try 4900-4917, 4901, or 49500WS.
Features & Benefits
- Eutectic alloy (liquidus = solidus temperature)
- Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
- Flux meets J-STD-004B
- Spreads like rosin-activated flux
- Virtually non-splattering
- Non-corrosive residue
- Non-conductive residue
- Halide free
| Catalog Number | Size | Diameter | Gauge | Description |
|---|---|---|---|---|
| 4860-18G | 18 g (0.6 oz) | 0.81 mm (0.032 in) | 21 | Pocket pack |
| 4865-227G | 227 g (0.5 lb) | 0.81 mm (0.032 in) | 21 | Spool |
| 4865-454G | 454 g (1.0 lb) | 0.81 mm (0.032 in) | 21 | Spool |
Safety Data Sheet
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WARNING! This product can expose you to chemicals including lead, which is known to the State of California to cause cancer, and lead, which is known to the State of California to cause birth defects or other reproductive harm For more information go to www.P65Warnings.ca.gov. |
