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4860P - Sn63/Pb37 Solder Paste - No-Clean
4860P – Sn63/Pb37 solder paste, also known as Sn63 solder paste or 63 37 solder paste, is a no-clean solder paste that is made from a blend of high purity, non-recycled tin and lead alloy powder combined with a no-clean flux to form a paste. It is designed for surface mount applications and provides high tack force and good wettability. The post-soldering residues are transparent, nonconductive, non-corrosive, and highly insulated. (“No-clean” means that residues are not harmful to assemblies.)
Sn63/pb37 solder paste is designed for use in high-speed printing and is an ideal choice for SMT solder paste printers. It can yield brick-like prints even when using ultra-fine pitch stencils as small as 0.3 mm.
We also offer a no-clean lead-free solder paste and a no-clean low temperature solder paste.
Features & Benefits
- Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
- Flux meets J-STD-004B
- Non-corrosive
- Non-conductive residue
- Halide-free
- Good wettability
- Type 3 (45-25 µm)
| Part # | Net Vol. | Net Wt. | Packaging | Unboxing |
| 4860P-35G | 4.21 mL | 35 g | Syringe |
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Safety Data Sheet
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WARNING! This product can expose you to chemicals including lead, which is known to the State of California to cause cancer, and lead, which is known to the State of California to cause birth defects or other reproductive harm. For more information go to www.P65Warnings.ca.gov. |