4900P – SAC305 Solder Paste – No-Clean

4900P SAC305 Solder Paste is a no-clean solder paste made from a blend of high-purity, non-recycled tin, silver and copper metal powder mixed with a no-clean flux. This halogen-free and lead-free solder paste is designed for extreme flux activity and the enhanced printing requirements of ultra-fine pitch applications. It provides excellent wetting on copper OSP-coatings. Wide reflow process windows combined with high thermal stability yield solder joints with smooth surfaces.

  • Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
  • Flux meets J-STD-004B
  • Repeatable and consistent printing characteristics
  • Long stencil and tack life facilitate high speed printing
  • Excellent wettability
  • Suitable for air or nitrogen atmospheres
  • Medium-soft, non-cracking residues

4900P is the best lead-free solder paste for facilitating high speed printing. It can yield brick-like prints even when using ultra-fine pitch stencils as small as 0.3 mm.

We also offer a no-clean Sn63/Pb37 solder paste and a no-clean low temperature solder paste.

Part # Net Vol. Net Wt. Packaging Packaging Preview
4900P-25G 3.38 mL 25 g Syringe
4900P-250G 33.8 mL 250 g Jar
4900P - SAC305 Solder Paste - No Clean
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