832FXC – Flexible Epoxy Resin

832FXC is a clear version of our popular black flexible epoxy potting, 832FX. It is a 2-component, clear, low-viscosity, flexible epoxy compound for potting and encapsulating circuit boards. Once cured, 832FXC has a low modulus making it suitable for applications involving aggressive thermal cycling.

  • Low mixed viscosity
  • Low modulus epoxy
  • Clear – allows for inspection
  • Strong adhesion to many substrates including metals, plastics, glass, composites, ceramics and wood
  • Extreme resistance to water and humidity

This product is designed for applications where minimizing the physical stress on components is critical. It performs well in low temperature and arctic environments, as well as applications that involve temperature cycling or rapid temperature changes. Because the cured product is clear, the potted circuitry can be routinely inspected as part of preventative maintenance.

Due to its very low mixed viscosity, it can easily penetrate small gaps and cavities. It also provides excellent electrical insulation and protects components from static discharge, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.

832FXC is our best flexible epoxy with a convenient 1:1 volume mix ratio, which makes it compatible with most dispensing equipment. It can be cured at room temperature or higher. For 2-part black rigid epoxies consider 832B or 832HD.

For 2-part clear rigid epoxies try 832C or 832WC. We also offer 2-part thermal epoxy and high temperature epoxy potting compounds.

Our 2-part flame-retardant epoxy potting compounds are 834B, 834HTC and 834FX.

For a 1-part epoxy try 9510.

We also offer polyurethane and silicone potting compounds.

Part # Net Vol. Net Wt. Packaging Packaging Preview
832FXC-450ML 450 mL 475 g 2 Bottle Kit
832FXC-1.7L 1.7 L 1.79 kg 2 Can Kit
832FXC-7.4L (MTO) 7.4 L 7.82 kg Dual Pail Kit
832FXC-40L (MTO) 40 L 42.2 kg Dual Pail Kit
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