4933-4935 - Sn100e No Clean Solder Wire




The 4933–4935 Sn100e No Clean Solder Wire is an electronic grade solder wire. It uses a high-purity, eutectic tin/copper/cobalt alloy that is complemented with a no clean, synthetically refined, splatter-proof, resin flux core. The 4933–4935 solder meets J-STD-004B, ASTM B 32, and exceeds J-STD-006C specifications.

This solder is a great lead-free alternative to leaded solders. It generally provides better wetting, contact angle, flow, and visual appearance than typical Sn63/Pb37 no clean solders, while still delivering excellent performance characteristics. It offers superior solder penetration into plated through holes and surface mount interconnects. Further, it is a suitable replacement for SAC305 solder since the 493x forms brighter, shinier, and less grainy joints. Furthermore, it is less expensive than SAC305.

The 4933–4935 solders achieve a consistent solder and flux percentage through a state-of-the-art, extrusion, wire-drawing machine. This machine continually monitors the wire to prevent voids and ensure consistency, providing a top-grade solder wire.

Features & Benefits

  • Eutectic alloy (liquidus = solidus temperature)
  • Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
  • Flux meets J-STD-004B
  • Spreads like rosin-activated flux
  • Virtually non-splattering
  • Non-corrosive resudues
  • Non-conductive resudues
  • Halide free
Catalog Number Sizes Available Diameter Gauge Description
4933-112G 112 g (0.25 lb) 0.51 mm (0.020″) 25 Spool
4933-454G 454 g (1.0 lb) 0.51 mm (0.020″) 25 Spool
4935-112G 112 g (0.25 lb) 0.81 mm (0.032″) 21 Spool
4935-454G 454 g (1.0 lb) 0.81 mm (0.032″) 21 Spool

Technical Documents

Technical Datasheet (TDS) -

Safety Data Sheet