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8329TCS – Thermal Adhesive, High TC

This high thermal conductivity adhesive paste is a 2-part epoxy with a long 4-hour working time. It is dark grey, smooth, viscous, thixotropic, and bonds well to a wide variety of substrates.

Thermal conductivity of 1.4 W/(m·K)
1:1 mix ratio
Working time: 4 hours
Cure time: 1 hour at 80 °C (176 °F)
Provides strong electrical insulation
High tensile strength
Strong resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons
Meets NASA low outgassing standard

Full Product Details

Use this thermal adhesive paste to glue heat sinks to LEDs, CPUs, and other heat-generating components. This product is highly viscous and must be mixed by hand prior to application. We also offer a lower viscosity alternative (8329TFS) suitable for use with mixing tips.

This adhesive has been formulated to have a long working time. We also offer fast-curing alternatives with 5-minute (8329TCF), and 45-minute (8329TCM) working times. Electrically conductive alternatives (8331S and 8330S) and thermal pastes are also available.

Available Sizes