MG Chemicals soldering flux provides high tack-force and superior wetting for both leaded and non-leaded solder alloys. The flux comes in both liquid and paste formats, and in Rosin Activated (RA), No-Clean (NC) and Water Soluble (WS) flux chemistries. Our fluxes provide exceptional adhesion to copper, and form an effective barrier against oxidation of circuit traces.
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4140A is a flux cleaner that cleans post-solder residues quickly and conveniently. Its plastics-safe formula removes rosin, non-rosin and no-clean fluxes, as well as both ionic and non-ionic residues.
8341 is a no-clean soldering flux paste. It is designed for lead-free alloys, but also works well with conventional leaded solders. This tacky no-clean flux paste uses a mix of rosin, thickener, and high-grade synthetically refined resin. The flux provides fast and widespread wetting during soldering and leaves non-conductive and non-tacky residues.
8342 is a premium RA rosin flux paste with moderate activation and a stiff pastelike consistency. It is easy to use and stays where it is applied.
835 is a rosin-based liquid flux with moderate activity. This rosin flux is composed of pure Water White (WW) grade gum rosin in a unique solvent system, combined with highly effective activators. Post-soldering residues from this RA liquid flux are non-conductive, non-corrosive, hydroscopic, non-tacky, and fungus resistant.
8351 is a halogen-free organic liquid solder flux with low activity. It is a no-clean flux with a low solids content that leaves virtually no residue. Solder joints appear shiny after soldering, even without cleaning.
836LFNC is a halogen-free, low-activity, organic soldering flux for electronics. It has a low solids content and leaves virtually no residue. Solder joints appear shiny after soldering, even without cleaning.
837LFWS is a water-soluble flux with a neutral pH at room temperature that becomes highly activated at soldering temperatures. Post-soldering flux residues must be cleaned, but are easily removed with water.
4140A is a flux cleaner that cleans post-solder residues quickly and conveniently. Its plastics-safe formula removes rosin, non-rosin and no-clean fluxes, as well as both ionic and non-ionic residues.
8341 is a no-clean soldering flux paste. It is designed for lead-free alloys, but also works well with conventional leaded solders. This tacky no-clean flux paste uses a mix of rosin, thickener, and high-grade synthetically refined resin. The flux provides fast and widespread wetting during soldering and leaves non-conductive and non-tacky residues.
8342 is a premium RA rosin flux paste with moderate activation and a stiff pastelike consistency. It is easy to use and stays where it is applied.
835 is a rosin-based liquid flux with moderate activity. This rosin flux is composed of pure Water White (WW) grade gum rosin in a unique solvent system, combined with highly effective activators. Post-soldering residues from this RA liquid flux are non-conductive, non-corrosive, hydroscopic, non-tacky, and fungus resistant.
8351 is a halogen-free organic liquid solder flux with low activity. It is a no-clean flux with a low solids content that leaves virtually no residue. Solder joints appear shiny after soldering, even without cleaning.
836LFNC is a halogen-free, low-activity, organic soldering flux for electronics. It has a low solids content and leaves virtually no residue. Solder joints appear shiny after soldering, even without cleaning.
837LFWS is a water-soluble flux with a neutral pH at room temperature that becomes highly activated at soldering temperatures. Post-soldering flux residues must be cleaned, but are easily removed with water.
