Solder Wire

4870–4875 Sn60/Pb40 No-Clean Solder Wire is electronics grade solder wire. The 60/40 solder uses a classic tin-to-lead alloy ratio, which is complemented by a no-clean, synthetically refined, spatter-proof resin flux core. Our 60/40 tin-lead solder wire meets J-STD-004B, ASTM B 32 and J-STD-006C specifications. It melts at a slightly higher temperature, and over a wider temperature range, than classic 63/37 solder. It is the best 60/40 solder for creating robust and reliable joints that are highly resistant to whisker formation.

4880–4888 Sn63/Pb37 RA Solder Wire is electronics grade solder wire. This 63/37 solder uses the eutectic tin-to-lead alloy ratio, which is complemented with an RA-like flux core. This tin-lead solder wire meets J-STD-004B, ASTM B 32, and exceeds J-STD-006C specifications. It is one of the easiest solders to work with because it offers a low-melting temperature with a sharp melting/solidification point, which results in robust and reliable joints that are highly resistant to whisker formation.