Filter

Showing all 7 results

Solder Wire

MG Chemicals offers an extensive portfolio of solder wire designed to cover the needs of all users, from hobbyists to large manufacturers. From traditional leaded solder to more advanced alloys that melt at higher temperatures, MG Chemicals offers a wide range of flux types, gauges and package sizes.

Ask An ExpertArticles & Videos
Solder Wire
4860-4865 - Sn63/Pb37 No Clean Solder Wire

4860-4865 – Sn63/Pb37 No-Clean Solder Wire

4860–4865 Sn63/Pb37 No-Clean Solder Wires is electronics grade solder wire. This no-clean solder wire uses the standard eutectic tin-to-lead alloy ratio, which is complemented by a no-clean, synthetically refined, splatter-proof, resin flux core. It meets J-STD-004B, ASTM B 32, and exceeds J-STD-006C specifications. 63/37 solder wire is one of the easiest solders to work with because it combines a low-melting temperature with a sharp melting/solidification point, which results in robust and reliable joints that are highly resistant to whisker formation.

Read More »
4870-4875 - Sn60/Pb40 No-Clean Solder Wire

4870-4875 – Sn60/Pb40 No-Clean Solder Wire

4870–4875 Sn60/Pb40 No-Clean Solder Wire is electronics grade solder wire. The 60/40 solder uses a classic tin-to-lead alloy ratio, which is complemented by a no-clean, synthetically refined, spatter-proof resin flux core. Our 60/40 tin-lead solder wire meets J-STD-004B, ASTM B 32 and J-STD-006C specifications. It melts at a slightly higher temperature, and over a wider temperature range, than classic 63/37 solder. It is the best 60/40 solder for creating robust and reliable joints that are highly resistant to whisker formation.

Read More »
4880-4888 - Sn63/Pb37 RA Solder Wire

4880-4888 – Sn63/Pb37 RA Solder Wire

4880–4888 Sn63/Pb37 RA Solder Wire is electronics grade solder wire. This 63/37 solder uses the eutectic tin-to-lead alloy ratio, which is complemented with an RA-like flux core. This tin-lead solder wire meets J-STD-004B, ASTM B 32, and exceeds J-STD-006C specifications. It is one of the easiest solders to work with because it offers a low-melting temperature with a sharp melting/solidification point, which results in robust and reliable joints that are highly resistant to whisker formation.

Read More »
4890-4898 – Sn60/Pb40 RA Solder Wire

4890-4898 – Sn60/Pb40 RA Solder Wire

4890–4898 Sn60/Pb40 RA Solder Wire is electronics grade solder wire. The 60/40 rosin core solder uses a classic tin-to-lead alloy ratio complemented by a RA-like flux core. This solder wire meets J-STD-004B, ASTM B 32, and exceeds J-STD-006C specifications. It melts at slightly higher temperatures and over a wider temperature range than 63/37 solder. This results in robust and reliable joints that are highly resistant to whisker formation.

Read More »
4900 - SAC305 No Clean Solder Wire

4900 – SAC305 No-Clean Solder Wire

4900 SAC305 No-Clean Solder Wire is electronics grade solder wire. This lead-free solder uses the predominant lead-free alloy composition, exceeds J-STD-006C and meets ASTM B 32 purity specifications. It is complemented with a no-clean, synthetically refined, spatter-proof resin flux core that is classified as REL0 according to J-STD-004B. This solder is a great alternative to leaded solders.

Read More »
4901 - Sn99 No Clean Solder Wire

4901 – Sn99 No-Clean Solder Wire

4901 Sn99 No-Clean Solder Wire is a solder wire for electronics. It uses a high-purity eutectic Sn99.3/Cu0.7 alloy, complemented by a no-clean, synthetically refined, spatter-proof resin flux core. 4901 solder meets J-STD-004B, ASTM B 32, and exceeds J-STD-006C specifications.

Read More »
49500WS - Sn100e Water Soluble Solder Wire

49500WS – Sn100e Water-Soluble Solder Wire

49500WS Sn100e Water Soluble Solder Wire is an electronics grade solder wire. It uses a high-purity, eutectic 99.5% tin / 0.5% copper and cobalt alloy, complemented by a water-soluble flux core. 49500WS solder meets J-STD-004B, ASTM B 32, and exceeds J-STD-006C specifications.

Read More »
4860-4865 - Sn63/Pb37 No Clean Solder Wire

4860-4865 – Sn63/Pb37 No-Clean Solder Wire

4860–4865 Sn63/Pb37 No-Clean Solder Wires is electronics grade solder wire. This no-clean solder wire uses the standard eutectic tin-to-lead alloy ratio, which is complemented by a no-clean, synthetically refined, splatter-proof, resin flux core. It meets J-STD-004B, ASTM B 32, and exceeds J-STD-006C specifications. 63/37 solder wire is one of the easiest solders to work with because it combines a low-melting temperature with a sharp melting/solidification point, which results in robust and reliable joints that are highly resistant to whisker formation.

Read More »
4870-4875 - Sn60/Pb40 No-Clean Solder Wire

4870-4875 – Sn60/Pb40 No-Clean Solder Wire

4870–4875 Sn60/Pb40 No-Clean Solder Wire is electronics grade solder wire. The 60/40 solder uses a classic tin-to-lead alloy ratio, which is complemented by a no-clean, synthetically refined, spatter-proof resin flux core. Our 60/40 tin-lead solder wire meets J-STD-004B, ASTM B 32 and J-STD-006C specifications. It melts at a slightly higher temperature, and over a wider temperature range, than classic 63/37 solder. It is the best 60/40 solder for creating robust and reliable joints that are highly resistant to whisker formation.

Read More »
4880-4888 - Sn63/Pb37 RA Solder Wire

4880-4888 – Sn63/Pb37 RA Solder Wire

4880–4888 Sn63/Pb37 RA Solder Wire is electronics grade solder wire. This 63/37 solder uses the eutectic tin-to-lead alloy ratio, which is complemented with an RA-like flux core. This tin-lead solder wire meets J-STD-004B, ASTM B 32, and exceeds J-STD-006C specifications. It is one of the easiest solders to work with because it offers a low-melting temperature with a sharp melting/solidification point, which results in robust and reliable joints that are highly resistant to whisker formation.

Read More »
4890-4898 – Sn60/Pb40 RA Solder Wire

4890-4898 – Sn60/Pb40 RA Solder Wire

4890–4898 Sn60/Pb40 RA Solder Wire is electronics grade solder wire. The 60/40 rosin core solder uses a classic tin-to-lead alloy ratio complemented by a RA-like flux core. This solder wire meets J-STD-004B, ASTM B 32, and exceeds J-STD-006C specifications. It melts at slightly higher temperatures and over a wider temperature range than 63/37 solder. This results in robust and reliable joints that are highly resistant to whisker formation.

Read More »
4900 - SAC305 No Clean Solder Wire

4900 – SAC305 No-Clean Solder Wire

4900 SAC305 No-Clean Solder Wire is electronics grade solder wire. This lead-free solder uses the predominant lead-free alloy composition, exceeds J-STD-006C and meets ASTM B 32 purity specifications. It is complemented with a no-clean, synthetically refined, spatter-proof resin flux core that is classified as REL0 according to J-STD-004B. This solder is a great alternative to leaded solders.

Read More »
4901 - Sn99 No Clean Solder Wire

4901 – Sn99 No-Clean Solder Wire

4901 Sn99 No-Clean Solder Wire is a solder wire for electronics. It uses a high-purity eutectic Sn99.3/Cu0.7 alloy, complemented by a no-clean, synthetically refined, spatter-proof resin flux core. 4901 solder meets J-STD-004B, ASTM B 32, and exceeds J-STD-006C specifications.

Read More »
49500WS - Sn100e Water Soluble Solder Wire

49500WS – Sn100e Water-Soluble Solder Wire

49500WS Sn100e Water Soluble Solder Wire is an electronics grade solder wire. It uses a high-purity, eutectic 99.5% tin / 0.5% copper and cobalt alloy, complemented by a water-soluble flux core. 49500WS solder meets J-STD-004B, ASTM B 32, and exceeds J-STD-006C specifications.

Read More »
  • High purity – Solder purity exceeds J-std-006C
  • High quality – Flux meets J-std-004B
  • Variety – Multiple compositions, sizes and flux types available
  • Soldering components onto PCBs – Ideal for small-scale production and prototyping

Why is the solder taking so long to melt?

The obvious culprit would be there’s insufficient heat applied to the wire so more heat is needed. If using a soldering iron, it could be there’s too much buildup of oxides on the tip and it needs to be cleaned with tip tinner.

Why are my solder joints dull and not shiny?

Dull solder joints can be referred to as cold solder joints and are caused by inadequate cleaning prior to soldering or insufficient heat during soldering. Aside from esthetics, these joints have compromised electrical and mechanical integrity and should be removed using desoldering braid.

Is it necessary to clean the flux residues after soldering?

No, it’s not necessary as the residues are non-conductive and non-corrosive; however, if conformal coating is the next step in fabrication, it is a good idea to clean the residues as incompatibilities can lead to dewetting of the coating.

How Can We Help?