Filter

Showing all 3 results

Solder Pastes

MG Chemicals’ solder pastes ensure strong adhesion when connecting PCB components to copper pads during board fabrication. Our solder pastes contain a non-conductive flux, making cleaning afterwards unnecessary, plus solder powder with a particle size distribution that complies with the J-STD-005 Type 3 (80% min. between 25-45 µm).

Pastes are available in both leaded and non-leaded chemistries, with syringe or jar packaging options. They can be applied easily using a solder paste spatula, solder paste dispensers, or solder paste stencils.

Ask An ExpertArticles & Videos
Solder Pastes
4860P - Sn63/Pb37 Solder Paste - No Clean

4860P – Sn63/Pb37 Solder Paste – No-Clean

4860P – Sn63/Pb37 solder paste, also known as Sn63 solder paste or 63 37 solder paste, is a no-clean solder paste that is made from a blend of high purity, non-recycled tin and lead alloy powder combined with a no-clean flux to form a paste. It is designed for surface mount applications and provides high tack force and good wettability. The post-soldering residues are transparent, nonconductive, non-corrosive, and highly insulated. (“No-clean” means that residues are not harmful to assemblies.)

Read More »
4900P - SAC305 Solder Paste - No Clean

4900P – SAC305 Solder Paste – No-Clean

4900P SAC305 Solder Paste is a no-clean solder paste made from a blend of high-purity, non-recycled tin, silver and copper metal powder mixed with a no-clean flux. This halogen-free and lead-free solder paste is designed for extreme flux activity and the enhanced printing requirements of ultra-fine pitch applications. It provides excellent wetting on copper OSP-coatings. Wide reflow process windows combined with high thermal stability yield solder joints with smooth surfaces.

Read More »
4902P - Sn42/Bi57/Ag1 Low Temperature Solder Paste T3

4902P – Sn42/Bi57/Ag1 Low Temperature Solder Paste T3

4902P Sn42/Bi57/Ag1 is a low temperature solder made for surface mount applications. This SMT solder paste spreads and adheres well to a variety of materials, and provides excellent soldering results and appearances. A uniform low temperature solder paste, it dispenses evenly and resists solder beading and bright spots.

Read More »
4860P - Sn63/Pb37 Solder Paste - No Clean

4860P – Sn63/Pb37 Solder Paste – No-Clean

4860P – Sn63/Pb37 solder paste, also known as Sn63 solder paste or 63 37 solder paste, is a no-clean solder paste that is made from a blend of high purity, non-recycled tin and lead alloy powder combined with a no-clean flux to form a paste. It is designed for surface mount applications and provides high tack force and good wettability. The post-soldering residues are transparent, nonconductive, non-corrosive, and highly insulated. (“No-clean” means that residues are not harmful to assemblies.)

Read More »
4900P - SAC305 Solder Paste - No Clean

4900P – SAC305 Solder Paste – No-Clean

4900P SAC305 Solder Paste is a no-clean solder paste made from a blend of high-purity, non-recycled tin, silver and copper metal powder mixed with a no-clean flux. This halogen-free and lead-free solder paste is designed for extreme flux activity and the enhanced printing requirements of ultra-fine pitch applications. It provides excellent wetting on copper OSP-coatings. Wide reflow process windows combined with high thermal stability yield solder joints with smooth surfaces.

Read More »
4902P - Sn42/Bi57/Ag1 Low Temperature Solder Paste T3

4902P – Sn42/Bi57/Ag1 Low Temperature Solder Paste T3

4902P Sn42/Bi57/Ag1 is a low temperature solder made for surface mount applications. This SMT solder paste spreads and adheres well to a variety of materials, and provides excellent soldering results and appearances. A uniform low temperature solder paste, it dispenses evenly and resists solder beading and bright spots.

Read More »

How Can We Help?