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Solder Pastes

MG Chemicals’ solder pastes ensure strong adhesion when connecting PCB components to copper pads during board fabrication. Our solder pastes contain a non-conductive flux, making cleaning afterwards unnecessary, plus solder powder with a particle size distribution that complies with the J-STD-005 Type 3 (80% min. between 25-45 µm).

Pastes are available in both leaded and non-leaded chemistries, with syringe or jar packaging options. They can be applied easily using a solder paste spatula, solder paste dispensers, or solder paste stencils.

Features & Benefits

  • Leaded and non-leaded options available
  • Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
  • No-clean residues, residues are not harmful to assemblies
  • Flux meets J-STD-004B
  • RoHS-compliant


  • Repairs and rework
  • Through-hole and surface mount
  • Solder touch-ups
  • Component bonding

4860P Sn63/Pb37 No- clean solder paste

4900PSAC305 No-clean solder paste

4902PSn42/Bi57/Ag1 No-clean low temperature solder paste