8329TFF – Fast Cure Thermal Adhesive
This thermal conductive glue is a 2-part, one-one system with a set time of only 15 minutes. The adhesive is a smooth off-white paste that cures to a hard, durable polymer. Once cured, the epoxy is thermally conductive, yet electrically insulating. 8329TFF is UL 94 V-0 registered as flame retardant (UL File# E334302).
The cured epoxy bonds strongly to metal, ceramic, glass, and most plastics used in electronic assemblies. Specifically, use thermally conductive adhesives like the 8329TFF to bond CPUs to the heat sink for improved thermal management. The lower viscosity of the thermal adhesive glue permits use as a potting compound.