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Thermally Conductive Adhesives

MG Chemicals offers thermally conductive epoxy adhesives for bonding heat sinks, LEDs, and other heat generating electronic components. They feature strong adhesion to metal, good adhesion to plastics, and excellent physical strength.

Our 1-part epoxies offer unlimited working time, do not require mixing, and can be stored at room temperature. 2-part epoxies are 1:1 mix ratio and are available in a variety of working times (w.t.).

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Thermally Conductive Adhesives
8329TCM - Thermal Adhesive, High TC

8329TCM – Thermal Adhesive, High TC

This heatsink adhesive paste is a 2-part, 1-1 epoxy system. It is a smooth, dark grey paste that cures to form a hard, durable, thermally conductive polymer. It provides strong electrical insulation and excellent protection from humidity, salt water, mild bases, and aliphatic hydrocarbons. It bonds well to metals, ceramics, glass, and most plastics used in electronic assemblies.

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8329TFF - Fast Cure Thermal Adhesive

8329TFF – Fast Cure Thermal Adhesive

This thermal conductive glue is a 2-part, one-one system with a set time of only 15 minutes. The adhesive is a smooth off-white paste that cures to a hard, durable polymer. Once cured, the epoxy is thermally conductive, yet electrically insulating. 8329TFF is UL 94 V-0 registered as flame retardant (UL File# E334302).

The cured epoxy bonds strongly to metal, ceramic, glass, and most plastics used in electronic assemblies. Specifically, use thermally conductive adhesives like the 8329TFF to bond CPUs to the heat sink for improved thermal management. The lower viscosity of the thermal adhesive glue permits use as a potting compound.

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8349TFM – Thermal Adhesive

This thermal adhesive is a 2-part 1-1 epoxy system. It is a smooth, dark, off-grey paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. It meets UL 94V-0 Standard as flame retardant. It bonds well to metals, ceramics, glass, and most plastics used in electronic assemblies.

Read More »
8329TCM - Thermal Adhesive, High TC

8329TCM – Thermal Adhesive, High TC

This heatsink adhesive paste is a 2-part, 1-1 epoxy system. It is a smooth, dark grey paste that cures to form a hard, durable, thermally conductive polymer. It provides strong electrical insulation and excellent protection from humidity, salt water, mild bases, and aliphatic hydrocarbons. It bonds well to metals, ceramics, glass, and most plastics used in electronic assemblies.

Read More »
8329TFF - Fast Cure Thermal Adhesive

8329TFF – Fast Cure Thermal Adhesive

This thermal conductive glue is a 2-part, one-one system with a set time of only 15 minutes. The adhesive is a smooth off-white paste that cures to a hard, durable polymer. Once cured, the epoxy is thermally conductive, yet electrically insulating. 8329TFF is UL 94 V-0 registered as flame retardant (UL File# E334302).

The cured epoxy bonds strongly to metal, ceramic, glass, and most plastics used in electronic assemblies. Specifically, use thermally conductive adhesives like the 8329TFF to bond CPUs to the heat sink for improved thermal management. The lower viscosity of the thermal adhesive glue permits use as a potting compound.

Read More »

8349TFM – Thermal Adhesive

This thermal adhesive is a 2-part 1-1 epoxy system. It is a smooth, dark, off-grey paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. It meets UL 94V-0 Standard as flame retardant. It bonds well to metals, ceramics, glass, and most plastics used in electronic assemblies.

Read More »

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