Powered by Google Translate

English Chinese (Simplified) French German Italian Japanese Korean Portuguese Russian Spanish

The 4870–4877 of Sn60Pb40 No Clean Solder Wire is an electronic grade solder wire. It uses a classical tin-to-lead alloy ratio, which is complemented with a no clean, synthetically refined, splatter-proof, resin flux core. The solder wires meet J-STD-004B, ASTM B 32, and J-STD-006C specifications. It melts at a slightly higher temperature and over a wider range than the classical 63/37 solder. It results in robust and reliable joints that are highly resistant to whisker formation.

The leaded solders achieve a consistent solder and flux percentage through a state-of-the-art, extrusion, wire-drawing machine. This machine continually monitors the wire to prevent voids and ensure consistency, providing a top-grade solder wire.


  • Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
  • Flux meets J-STD-004B
  • Spreads like rosin-activated flux
  • Virtually non-splattering
  • Non-corrosive residue
  • Non-conductive residue
  • Halide free
Catalog Number Size Diameter Gauge Description
4870-18G 18g (0.6 oz) 00.81 mm (0.032 in) 21 Pocket pack
4875-227G 227 g (0.5 lb) 00.81 mm (0.032 in) 21 Spool
4875-454G 454 g (1.0 lb) 00.81 mm (0.032 in) 21 Spool
4877-227G 227 g (0.5 lb) 1.27 mm (0.050 in) 18 Spool

Safety Data Sheet
Technical Data Sheet

Related Products