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The 4870–4877 of Sn60Pb40 No Clean Solder Wire is an electronic grade solder wire. It uses a classical tin-to-lead alloy ratio, which is complemented with a no clean, synthetically refined, splatter-proof, resin flux core. The solder wires meet J-STD-004B, ASTM B 32, and J-STD-006C specifications. It melts at a slightly higher temperature and over a wider range than the classical 63/37 solder. It results in robust and reliable joints that are highly resistant to whisker formation.

The leaded solders achieve a consistent solder and flux percentage through a state-of-the-art, extrusion, wire-drawing machine. This machine continually monitors the wire to prevent voids and ensure consistency, providing a top-grade solder wire.

 

Features
  • Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
  • Flux meets J-STD-004B
  • Spreads like rosin-activated flux
  • Virtually non-splattering
  • Non-corrosive residue
  • Non-conductive residue
  • Halide free
Catalog Number Size Diameter Gauge Description
4870-18G 18g (0.6 oz) 00.81 mm (0.032 in) 21 Pocket pack
4875-227G 227 g (0.5 lb) 00.81 mm (0.032 in) 21 Spool
4875-454G 454 g (1.0 lb) 00.81 mm (0.032 in) 21 Spool
4877-227G 227 g (0.5 lb) 1.27 mm (0.050 in) 18 Spool

Safety Data Sheet
Technical Data Sheet

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