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The 4890–4898 Sn60Pb40 RA Solder Wire is an electronic grade solder wire. It uses a classical tin-to-lead alloy ratio, which is complemented with a RA-like flux core. The solder wires meet J-STD-004B, ASTM B 32, and exceeds J-STD-006C specifications. It melts at a slightly higher temperature and over a wider range than the 63/37 solder. It results in robust and reliable joints that are highly resistant to whisker formation.

The 489x leaded solders achieve a consistent solder and flux percentage through a state-of-the-art, extrusion, wire-drawing machine. This machine continually monitors the wire to prevent voids and ensure consistency, providing a top-grade solder wire.

 

Features
  • Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
  • Flux meets J-STD-004B
  • Rosin-activated flux
  • Fast wetting
  • Fast flowing
  • Non-corrosive residue
  • Non-conductive residue
Catalog Number Size Diameter Gauge Description
4890-18G 18g (0.6 oz) 0.81 mm (0.032 in) 21 Pocket pack
4894-227G 227 g (0.5 lb) 0.63 mm (0.025 in) 23 Spool
4894-454G 454 g (1 lb) 0.63 mm (0.025 in) 23 Spool
4895-227G 227 g (0.5 lb) 0.81 mm (0.032 in) 21 Spool
4895-454G 454 g (1 lb) 0.81 mm (0.032 in) 21 Spool
4896-227G 227 g (0.5 lb) 1.01 mm (0.040 in) 19 Spool
4896-454G 454 g (1 lb) 1.01 mm (0.040 in) 19 Spool
4897-227G 227 g (0.5 lb) 1.27 mm (0.050 in) 18 Spool
4897-454G 454 g (1 lb) 1.27 mm (0.050 in) 18 Spool
4898-227G 1227 g (0.5 lb) 1.57 mm (0.062 in) 16 Spool
4898-454G 454 g (1 lb) 1.57 mm (0.062 in) 16 Spool

 

Safety Data Sheet
Technical Data Sheet